Fractal frontiers in microelectronic ceramic materials

Microelectronic Materials Characterization: an Update

In a previous article, I various microelectronic materials analysis and characterization tools and techniques were presented with a focus on ensuring the quality of APL'S microelectronic products. Those tools and techniques can also be applied to the development of new materials and products for current and future microelectronics applications. This article discusses the development, characteri...

Application of All Ceramic Materials in Dentistry

The daily increase in Patientschr('39') demand for cosmetic treatments has led to dental restorations moving towards the use of all-ceramic materials. The development of all-ceramic restorations over the last decade has revolutionized aesthetic dentistry. Recent advances in ceramic manufacturing and processing methods have led to the evolutionary growth of all-ceramic materials with superior bi...

Frontiers in regenerative medical materials

Jun Ma, Insup Noh, In-Seop Lee* and Shengmin Zhang* Advanced Biomaterials and Tissue Engineering Center, Huazhong University of Science and Technology, Wuhan 430074, China; Department of Chemical and Biomolecular Engineering, Convergence Institute of Biomedical Engineering and Biomaterials, Seoul National University of Science and Technology, Seoul 139-743 Korea and Institute of Natural Science...

MEDICAL USE OF CERAMIC MATERIALS

Residual stress prediction for microelectronic packaging materials

At cure temperatures below Tg the cure shrinkage contributes significantly to residual stress build-up. Residual stresses in a flip chip package The cure shrinkage model was implemented in FE code. In figures 2 and 3 the residual stress build-up for a 2D plane strain model of an adhesively bonded flip chip is shown. A schematic representation of the model is given in the inset of figure 3. For ...